Part Number Hot Search : 
HZS11C3 23C440 LM190 KBPC5006 LM190 40040 BYT78 MBT44
Product Description
Full Text Search
 

To Download 2SK3513-01L Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 2SK3513-01L,S,SJ
FUJI POWER MOSFET
N-CHANNEL SILICON POWER MOSFET
Outline Drawings [mm]
200303
Super FAP-G Series
Features
High speed switching Low on-resistance No secondary breadown Low driving power Avalanche-proof
P4
Applications
Switching regulators UPS (Uninterruptible Power Supply) DC-DC converters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25C unless otherwise specified)
Ratings 600 12 48 30 12 183 20 5 1.67 195 +150 Operating and storage -55 to +150 temperature range *1 L=2.33mH, Vcc=60V, See to Avalanche Energy Graph *2 Tch <150C = *3 IF< -ID, -di/dt=50A/s, Vcc < BVDSS, Tch < 150C *4 VDS < 600V = = = = Item Drain-source breakdown voltaget Gate threshold voltage Zero gate voltage drain current Gate-source leakage current Drain-source on-state resistance Forward transcondutance Input capacitance Output capacitance Reverse transfer capacitance Turn-on time ton Turn-off time toff Total Gate Charge Gate-Source Charge Gate-Drain Charge Avalanche capability Diode forward on-voltage Reverse recovery time Reverse recovery charge Symbol V(BR)DSS VGS(th) IDSS IGSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD IAV VSD trr Qrr Item Drain-source voltage Continuous drain current Pulsed drain current Gate-source voltage Repetitive or non-repetitive Maximum Avalanche Energy Maximum Drain-Source dV/dt Peak Diode Recovery dV/dt Max. power dissipation Symbol VDS ID ID(puls] VGS IAR *2 EAS *1 dVDS/dt *4 dV/dt *3 PD Ta=25C Tc=25C Tch Tstg Unit V A A V A mJ kV/s kV/s W C C
Equivalent circuit schematic
Drain(D)
Gate(G) Source(S)
Electrical characteristics (Tc =25C unless otherwise specified)
Test Conditions VGS=0V ID=1mA ID= 250A VDS=VGS Tch=25C VDS=600V VGS=0V Tch=125C VDS=480V VGS=0V VGS=30V VDS=0V ID=5A VGS=10V ID=5A VDS=25V VDS=25V VGS=0V f=1MHz VCC=300V ID=5A VGS=10V RGS=10 VCC=250V ID=10A VGS=10V L=2.33mH Tch=25C IF=10A VGS=0V Tch=25C IF=10A VGS=0V -di/dt=100A/s Tch=25C
Min.
600 3.0
Typ.
Max.
5.0 25 250 100 0.75
Units
V V A nA S pF
4
10 0.58 8 1200 1800 140 210 6 9 17 26 15 23 35 53 7 11 30 45 11 16.5 10 15 1.00 0.75 5.0
ns
nC
12 1.50
A V s C
Thermalcharacteristics
Item Thermal resistance Symbol Rth(ch-c) Rth(ch-a) Test Conditions channel to case channel to ambient
Min.
Typ.
Max.
0.641 75.0
Units
C/W C/W
1
2SK3513-01L,S,SJ
Characteristics
Allowable Power Dissipation PD=f(Tc)
FUJI POWER MOSFET
250
500 450
Maximum Avalanche Energy vs. starting Tch EAS=f(starting Tch):Vcc=60V
200
400 350
IAS=5A
150
300
EAS [mJ]
0 25 50 75 100 125 150
PD [W]
250 IAS=8A 200 150 IAS=12A
100
50
100 50
0
0
0
25
50
75
100
125
150
Tc [C]
starting Tch [C]
Typical Output Characteristics
ID=f(VDS):80s Pulse test,Tch=25C
22 20 18 10 16 14 20V 10V 8V 7.5V
Typical Transfer Characteristic
ID=f(VGS):80s Pulse test, VDS=25V,Tch=25C
ID [A]
12 7.0V 10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 VGS=6.5V
ID[A]
1 0.1 0
1
2
3
4
5
6
7
8
9
10
VDS [V]
VGS[V]
Typical Transconductance
gfs=f(ID):80s Pulse test, VDS=25V,Tch=25C
100
Typical Drain-Source on-state Resistance
RDS(on)=f(ID):80s Pulse test, Tch=25C
2.0 VGS=6.5V 7.0V
1.5
RDS(on) [ ]
10
gfs [S]
1.0
7.5V8V 10V 20V
1
0.5
0.1 0.1 1 10
0.0 0 5 10 15 20
ID [A]
ID [A]
2
2SK3513-01L,S,SJ
FUJI POWER MOSFET
Drain-Source On-state Resistance RDS(on)=f(Tch):ID=5A,VGS=10V
2.0 1.8 1.6 1.4
7.0 6.5 6.0 5.5 5.0
Gate Threshold Voltage vs. Tch VGS(th)=f(Tch):VDS=VGS,ID=250uA
max.
VGS(th) [V]
RDS(on) [ ]
4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0
min.
1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25 0 25 50 75 100 125 150 typ. max.
0.5 0.0 -50 -25 0 25 50 75 100 125 150
Tch [C]
Tch [C]
Typical Gate Charge Characteristics
24 22 20 18 16 480V Vcc= 120V 300V
1n
VGS=f(Qg):ID=10A, Tch=25C
10n
Typical Capacitance C=f(VDS):VGS=0V,f=1MHz
Ciss
VGS [V]
14 12 10 8 6 4 2 0 0 10 20 30 40 50 60 70 80
1p 10
-1
C [F]
100p
Coss
10p Crss
10
0
10
1
10
2
10
3
Qg [nC]
VDS [V]
Typical Forward Characteristics of Reverse Diode
100
Typical Switching Characteristics vs. ID
t=f(ID):Vcc=300V, VGS=10V, RG=10
IF=f(VSD):80s Pulse test,Tch=25C
10 10
2
tr td(off)
IF [A]
t [ns]
td(on) 10
1
tf
1
10 0.1 0.00
0
0.25
0.50
0.75
1.00 VSD [V]
1.25
1.50
1.75
2.00
10
0
10
1
ID [A]
3
2SK3513-01L,S,SJ
Maximum Transient Thermal Impedance Zth(ch-c)=f(t):D=0
FUJI POWER MOSFET
10
1
10
0
Zth(ch-c) [C/W]
10
-1
10
-2
10
-3
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
t [sec]
10
2
Maximum Avalanche Current vs Pulse width IAV=f(tAV):starting Tch=25C,Vcc=60V
Avalanche Current I AV [A]
Single Pulse
1
10
10
0
10
-1
10 -8 10
-2
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
tAV [sec]
Outline Drawings (mm)
Type(L) Type(S) Type(SJ)
4
1
23
1 42 3
1
23
1 2 3
http://www.fujielectric.co.jp/denshi/scd/
4


▲Up To Search▲   

 
Price & Availability of 2SK3513-01L

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X